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    無硅導熱膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅導熱脂Thermal Compound TC70 7028328

    時間:2015年03月04日 瀏覽:
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    無硅導熱膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅導熱脂Thermal Compound TC70 7028328

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    計價單位:人民幣

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    • 無硅導熱膏70-D THERMO-LUBRICANT silicon-free 70-D,400g不含硅導熱脂Thermal Compound TC70 7028328

      tc70熱物是一種獨特的合成為基礎的產品線熱潤滑脂具有優良的熱傳導性。他們是在用工業如電子產品(電腦,家電,無線,等),汽車,和電以確?焖,高效的傳熱和散熱。初級
      這些非硅產品的優勢是長期的材料穩定性。
      tc70化合物不浸,干燥,硬化,或熔體在正常工業用途。
      熱化合物
      規格
      tc70 tc70-340wc tc70-57000財產
      320 340材料的一致性
      (滲透,
      工作,60X)
      比重2.7 2.7 n/a
      °C 25
      排0.1 0 0.5
      24小時。,% /體重在200 C 150 C°°°C 200
      蒸發量0.6 1 1
      24小時。,% /體重在200 C 150 C°°°C 200
      導熱系數0.92 1.3 2.4
      36 W / m K°°C
      電氣性能
      介電強度265 N / 305
      0.05“差距,V /軍醫
      介電常數5.02 N / 4.50
      °C 25,1000赫茲
      耗散因子0.0029 0.0022 n/a
      °C 25,1000赫茲
      體積電阻率為1.65×1014 20×1014 & lt;0.01
      歐姆厘米
      操作40 C 40 C°°°C 40
      溫度范圍為200℃到180℃°°°C 200
      外觀平整,光滑,光滑
      白色糊白糊膏
      tc70 tc70-340wc包應用
      7028323 7028332 10cc的桶,25克用分配器
      7028324 7028333 10cc的桶,25克的應用手冊
      7028325毫升75克7028334桶,用分配器
      7028326毫升75克7028335桶,手動應用
      7028336 55CC 7028327桶,100克用分配器
      7028328 7028337 6盎司盒,400克的分配閥
      7028329 7028338罐,1磅/ 450 g應用手冊
      7028330 7028339桶,80磅/ 36.3公斤的大批量應用
      tc70-57000包應用
      7028341 10cc的桶,50克用分配器
      7028342瓶,1盎司/ 28克應用手冊
      7028343罐,100克的應用手冊
      7028344罐,1磅/ 454 g應用手冊
      熱復合
      選擇
      tc70
      最廣泛使用的非硅熱復合。
      主要應用包括安裝功率晶體管,
      功率電阻器,二極管和其他半導體器件,
      耦合熱產生組件的底盤,傳熱
      介質對鎮流器,熱接頭,熱電偶,威爾斯,
      任何設備在有效的冷卻是必需的。
      tc70-340wc
      非常適合應用在一個設備可能需要
      在以后的時間從散熱片拆卸和清洗
      只有水。這種非硅熱復合
      具有高導熱性,優良的介電性能
      并將蔓延到一個非常薄的粘合線極低
      熱電阻。
      tc70-57000
      一個優質的電氣非硅熱復合
      和熱導率。主要的應用包括高
      電力電子器件如功率電阻器,
      二極管,晶體管和變壓器;小功率電子
      應用如靜態漏,接地,軟性電子
      連接,散熱,和組件的保護
      以及高功率電器的應用提高
      高功率開關和其他的運行效率
      滑動金屬觸點。

      Thermal Compounds
      TC70 thermal compounds are a product line of unique synthetic-based
      thermal greases with excellent thermal conductivity. They are used in industries
      such as electronics (computer, appliance, wireless, etc.), automotive, and
      electrical to ensure quick, efficient heat transfer and dissipation. The primary
      advantage of these non-silicone products is long-term material stability.
      TC70 compounds will not leach, dry, harden, or melt in normal industrial use.
      THERMAL COMPOUNDS
      Specifications
      Property TC70 TC70-340WC TC70-57000
      Consistency 320 340 250-350
      (Penetration,
      worked, 60x)
      Specific Gravity 2.7 2.7 N/A
      at 25°C
      Bleed 0.1 0 0.5
      24 Hrs., %/Weight at 200°C at 150°C at 200°C
      Evaporation 0.6 1 1
      24 Hrs., %/Weight at 200°C at 150°C at 200°C
      Thermal Conductivity 0.92 1.3 2.4
      36°C W/m °K
      Electrical Properties
      Dielectric strength 305 265 N/A
      0.05” gap, V/mil
      Dielectric constant 4.50 5.02 N/A
      25°C, 1,000 Hz
      Dissipation factor 0.0029 0.0022 N/A
      25°C, 1,000 Hz
      Volume Resistivity 1.65 x 1014 20.0 x 1014 < 0.01
      Ohm-cm
      Operating -40°C -40°C -40°C
      Temperature Range to 200°C to 180°C to 200°C
      Appearance Smooth, Smooth, Smooth
      Off-White Paste White Paste Paste
      TC70 TC70-340WC PACKAGE APPLICATION
      7028323 7028332 10cc barrel, 25 g For use with dispensers
      7028324 7028333 10cc barrel, 25 g For manual application
      7028325 7028334 30cc barrel, 75 g For use with dispensers
      7028326 7028335 30cc barrel, 75 g For manual application
      7028327 7028336 55cc barrel, 100 g For use with dispensers
      7028328 7028337 6 oz cartridge, 400 g For dispense valves
      7028329 7028338 jar, 1 lb / 450 g For manual application
      7028330 7028339 pail, 80 lb / 36.3 kg For high volume applications
      TC70-57000 PACKAGE APPLICATION
      7028341 10cc barrel, 50 g For use with dispensers
      7028342 jar, 1 oz / 28 g For manual application
      7028343 jar, 100 g For manual application
      7028344 jar, 1 lb / 454 g For manual application
      Thermal Compound
      Choices
      TC70
      The most widely used non-silicone thermal compound.
      Major applications include mounting power transistors,
      power resistors, diodes and other semiconductor devices,
      coupling heat generating assemblies to chassis, heat transfer
      medium on ballast, thermal joints, thermocouple wells, and
      for any device where efficient cooling is required.
      TC70-340WC
      Ideally suited for applications where a device may need to
      be removed from the heat sink at a later time and cleans
      up with only water. This non-silicone thermal compound
      has high thermal conductivity, excellent dielectric properties
      and will spread into a very thin bond line for extremely low
      thermal resistance.
      TC70-57000
      A non-silicone thermal compound with premium electrical
      and thermal conductivity. Major applications include high
      power electronic components such as power resistors,
      rectifiers, transistors and transformers; low power electronic
      applications such as static drain, grounding, soft electronic
      connections, heat dissipation, and assembly protection as
      well as high power electrical applications to improve the
      operational efficiency of high power switches and other
      sliding metal contacts.
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